The Future of Thermal Mitigation Technology for Electronics Showcased at Advancements in Thermal Management 2012 Conference

GREENWOOD VILLAGE, Colo.--(BUSINESS WIRE)--The Advancements in Thermal Management conference has announced its 2012 dates, Sept. 18-19, 2012 in Denver, Co. This event features educational presentations on the latest technology for managing temperature in electronics, including cooling, thermal imaging, temperature sensing and control, thermal interface materials and board level heating technology.

“With ever increasing processing power in electronic devices, the need for more advanced thermal mitigation technologies has become a priority for everyone involved in the design of these products”

This technical conference is specifically tailored for engineers, material scientists, CTOs, R&D managers and product developers designing new products and looking for best ways to mitigate temperature in their applications. If your products and services depend upon sophisticated and precise control of thermal properties and states, this is your must attend event of the year.

“With ever increasing processing power in electronic devices, the need for more advanced thermal mitigation technologies has become a priority for everyone involved in the design of these products,” said Nick Depperschmidt, conference chairman, Advancements in Thermal Management 2012. “We’ll likely never see processor speeds and electronics slow down, thus managing heat and even protecting these systems from severe cold is a priority for engineers and designers. That is why we’ve brought together some of the brightest minds in the industry to education our attendees on the latest thermal management technology and solutions.”

The technical program includes a free pre-conference workshop from thermal imaging leader FLIR and two days of educational presentations. Presenting companies and organizations include DARPA, Argonne National Lab, Zweben Consulting, University of Alabama in Huntsville, Watlow Electric and many more.

Advancements in Thermal Management 2012 will also be co-located with three industry-leading conferences: Battery Power 2012, Mobile Antenna Systems 2012 and Remote Monitoring and Control 2012. The co-located events will provide opportunities to network with potential new clients and share a combined exhibit hall floor, which is open to all attendees.