Novati Technologies Licenses Ziptronix’s Direct Oxide Bonding (ZiBond®) and Direct Bond Interconnect (DBI®) Patented Technologies For Advanced 3D Integrated Assemblies

RESEARCH TRIANGLE PARK, N.C.--(BUSINESS WIRE)--Ziptronix, Inc. has signed a licensing agreement with Novati Technologies, Inc. for the use of its patents covering direct bonding technology, ZiBond® and DBI®.

“We believe 3D is the new cutting edge of product development and we intend to continue our heritage as a contract R&D and lab-to-fab production facility enabling customers to cost-effectively prototype and test both 2.5D interposer and 3D designs with true, 3D integration and TSV interconnect.”

“We believe that Ziptronix’s patented direct bonding technology enables the industry’s best performance for applications such as 3D memory, BSI image sensors and a developing host of other applications,” said Dan Donabedian, CEO of Ziptronix. “With our DBI, which contains interconnect at the bond interface, Novati can now provide technologically advanced services in many different markets at a lower cost and better performance compared to competing technologies also attempting 3D integration."

"Adding Ziptronix 3D process technologies to Novati's existing wafer fabrication and testing facilities enables Novati to become the first open-platform, full-line foundry in the world offering 3D stacking services and test to all its customers," said Dave Anderson, CEO of Novati Technologies. "We believe 3D is the new cutting edge of product development and we intend to continue our heritage as a contract R&D and lab-to-fab production facility enabling customers to cost-effectively prototype and test both 2.5D interposer and 3D designs with true, 3D integration and TSV interconnect."

For more information about Ziptronix’s 3D IC technology and its licensing agreement with Novati Technologies, contact Chris Sanders at c.sanders@ziptronix.com, call 919-459-2444, or visit www.ziptronix.com. For more about Novati’s 3D and 2.5D technologies, contact Gretchen Patti at gpatti@tezzaron.com, call 630-505-0404, or visit www.tezzaron.com.

About Ziptronix

Ziptronix is a pioneer in the development of low-temperature direct bond technology for a variety of semiconductor applications, including backside-illuminated (BSI) sensors, RF front-ends, pico projectors, memories and 3D integrated circuits. Its patented, scalable 3D-integration technology, including ZiBond^® and DBI^®, provides the lowest-cost bonding solution for 3D technology, while enabling size reduction, yield enhancement, lower production costs and power consumption, and increased system performance. The company holds more than 35 U.S. patents and more than 20 international patents in nine foreign countries and Europe. It has more than 45 U.S. and international patent applications pending. Ziptronix licenses its technology throughout the semiconductor supply chain, including OEMs, IDMs and some fabrication and assembly facilities, and operates a back-end-of-line R&D facility with 6,000 square feet (557m2) of Class 100/1000 cleanroom space at its headquarters in Research Triangle Park, N.C. Ziptronix was founded in 2000 as a venture-backed spinoff of RTI International. Visit www.ziptronix.com

About Novati Technologies

Novati Technologies provides its new and existing customers with contract research and development, silicon wafer fabrication, and commercialization. Novati is adding new capabilities, including the manufacturing and assembly of leading-edge 3D-ICs.

Novati also serves companies in life sciences, aerospace, defense, MEMS, NEMS, and related devices. Its current fab capabilities include: