Tekelec to Exhibit at Mobile World Congress 2013, booth Hall 6, Stand 6E21, Feb 25 - 28, 2013, in Barcelona, ES

MORRISVILLE, N.C.--(BUSINESS WIRE)--Press Kit Materials are Available at: http://www.tradeshownews.com/events/Mobile-World-Congress-2013/tekelec/

Company:	Tekelec
Booth/Stand:	Hall 6, Stand 6E21
Event:	Mobile World Congress 2013 Feb 25 - 28, 2013 Barcelona, ES
Web:	http://www.tekelec.com
Facebook:	http://www.facebook.com/ForWhatsNext
Twitter:	http://twitter.com/tekelec
YouTube:	http://www.youtube.com/user/TekelecVideos
LinkedIn:	http://www.linkedin.com/company/tekelec

About Tekelec

Tekelec’s intelligent mobile broadband solutions enable service providers to manage and monetize mobile data in LTE, IMS and 3G networks. We are the architects of the New Diameter Network, a portfolio of session, policy and subscriber data management products that lays the foundation to evolve to software-defined ThinkingNetworks™. More than 300 service providers use our market-leading solutions to deliver cloud, machine-to-machine and personalized services to consumers and enterprises.