TE Connectivity Shows off Solutions for Smarter Small Cell Networks at Mobile World Congress

MINNEAPOLIS--(BUSINESS WIRE)--TE Connectivity today announced that it will display a range of distributed antenna systems (DAS) and optical infrastructure solutions that create smarter small cell networks at the Mobile World Congress show, booth 6D97, in Barcelona this week. Among the innovations to be shown are:

“Wireless networks out of necessity are moving toward small cell serving areas. TE has created solutions that lead the industry in small cell efficiency, performance, and scalability, and we are pleased to be presenting them at Mobile World Congress”

A CPRI interface card for TE digital distributed antenna system (DAS) products that further simplifies multiband, multiservice small cell distribution. A direct CPRI interface will bring unprecedented efficiencies to DAS by eliminating unnecessary dual conversion and amplification stages from the radios to the DAS Host.
Advancements to TE’s innovative high-powered, more energy efficient DAS radio heads. These advancements include additional frequency bands and digital capacity to their +43dBm HDM solutions supporting worldwide migration to 4G services such as LTE and multi-operator neutral host networks.
TE’s new Serial Link Combiner (SLC), which increases radio-over-fiber transport capabilities to 10 Gbps. With capacity needs continuing to increase, the SLC brings efficiencies to radio-over-fiber transport, offering advantages to baseband pooling and lessening the demand for fiber fronthaul.
TE’s Rapid Fiber panel slashes small cell solution deployment costs by simplifying construction and expansion of fiber in small cell networks. Its innovative RapidReel fiber cable spool helps ensure fast cable routing and easy handling by technicians, while offering maximum equipment space savings.

“Wireless networks out of necessity are moving toward small cell serving areas. TE has created solutions that lead the industry in small cell efficiency, performance, and scalability, and we are pleased to be presenting them at Mobile World Congress,” said Peter Wraight, vice president and general manager of TE’s Wireless business unit. “Our innovative approach to small cell architecture makes it easy for mobile operators to support and manage the integration of advanced service initiatives such as LTE into their network.”

TE’s booth will also feature a network model that highlights the advantages TE solutions bring to market – including the ability to easily upgrade networks, move capacity based on user demand and service uptake, and optimize fiber networks. TE executives, including Chief Technology Officer Rob Shaddock, will be on hand to discuss challenges and solutions for deploying small cell networks. All are welcome to stop by and chat with TE executives and industry colleagues at TE’s hospitality hour on February 25, 26 and 27 at 16:00 hours in their booth.

About TE Connectivity
TE Connectivity (NYSE: TEL) is a $13 billion world leader in connectivity. The company designs and manufactures products at the heart of electronic connections for the world’s leading industries including automotive, energy and industrial, broadband communications, consumer devices, healthcare, and aerospace and defense. TE Connectivity’s long-standing commitment to innovation and engineering excellence helps its customers solve the need for more energy efficiency, always-on communications and ever-increasing productivity. With nearly 90,000 employees in over 50 countries, TE Connectivity makes connections the world relies on to work flawlessly every day. To connect with the company, visit: www.TE.com.

ABOUT TE WIRELESS
TE Connectivity’s Wireless Business Unit provides innovative solutions for wireless, wireline, cable and enterprise networks around the world. A leader in distributed antenna systems (DAS) for in-building and small cell networks, TE’s solutions transform the way mobile service delivery networks are created, deployed and used for new mobile applications. TE’s solutions support a variety of multivendor, multi-technology and multiservice deployments. Learn more about these solutions at http://www.te.com/das.

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