Molex Illustrates Its Commitment To Developing Advanced High-Performance Interconnect And Optical Solutions

Company experts will present a range of high-speed, high-density products at OFC/NFOEC

LISLE, Ill.--(BUSINESS WIRE)--Molex Incorporated will showcase the company’s wide portfolio of interconnect and optical solutions for the telecommunications, data-communications, computing and medical industries at OFC/NFOEC, March 19 - 21, booth 2807. There will be multiple system demonstrations and product displays that highlight the company’s industry-leading, end-to-end solutions designed for next-generation applications.

Solution Demonstrations

• zQSFP+™ Interconnect System: Molex will join with other Optical Internetworking Forum (OIF) members to showcase 100 Gbps interconnect speeds during live demonstrations in both the OIF booth 2769 and Molex booth 2807. Molex zQSFP+ interconnects, which achieve speeds in excess of 100 Gbps, will operate in the demonstrations at up to 25.78 Gbps per lane and support OIF’s CEI-28G-VSR interfaces, 100 Gbps Ethernet and 100 Gbps InfiniBand* EDR applications. The demonstration will highlight several features of the zQSFP+ AOC based on highly integrated silicon photonics transceiver technology including its excellent transmission distance, unparalleled signal integrity, superior EMI protection and power consumption.
• zQSFP+ Active Optical Cable: In booth 2807, Molex will also demonstrate a silicon photonics-based zQSFP+ AOC running a 25.78 Gbps data link over a CEI-28G-VSR channel with Mindspeed’s M37040 and M37041 CDRs performing signal recovery and re-timing resulting in a very low jitter output signal, as demonstrated by the output eye pattern displayed. The zQSFP+ AOC also meets thermal requirements needed for high- density systems, paving the way for a new class of 100 Gbps networking interconnects.
• Impel™ Backplane Connector System: Molex will be demonstrating the new Impel backplane technology operating in compliance to CEI-25G-LR, 25 Gbps on 1m channel using Megtron 6 and Avago Technologies’ leading edge Vortex Gearbox† AVSP-1104 in booth 2807. The live demo will provide critical channel output through a complete high-speed link, leveraging Avago’s 28 nm SerDes technology to transmit 25 Gbps data error-free through the Molex Impel 6-pair backplane connectors, including transmit and receive daughter cards. The Impel backplane connector demo will allow attendees to witness and engage with Molex and Avago technical resources to better understand the requirements and challenges related to CEI-25G-LR and how Molex and Avago’s innovative solutions can address these requirements.

Products on Display

• QSFP+ 56Gbps (Fourteen Data Rate) silicon photonics optical solutions: The silicon photonics-based active optical cable (AOC) and MPO pigtail solutions provide low power, less expensive reliable transport for aggregated data rates up to 56 Gbps across singlemode fiber for much longer distances (4 km) than VCSEL based AOCs. Molex QSFP+ 56Gbps AOCs support a range of protocols including 10 and 40 Gigabit Ethernet, InfiniBand* QDR, InfiniBand* FDR and 12Gbps SAS 3.0 at speeds ranging from 1 to 14 Gbps. Molex QSFP+ to MPO pigtails allow for easy connection to singlemode structured cabling for longer distances at dramatically lower cost and power consumption than long reach optics solutions. As data rates continue to increase, Molex QSFP+ to MPO pigtails allow for easy upgrade to 28 Gbps and beyond – and since they support use of singlemode fiber structured cabling, the solution ensures the installation is future proofed to accommodate increasing bandwidth needs. Molex QSFP+ AOCs use transceivers based on silicon photonics ICs, offering vastly improved reliability and cost advantages over traditional optical modules while supporting the rapidly growing use of the industry standard QSFP MSA port.
• VITA 66.1 MT Ruggedized Optical Backplane Interconnect System: Designed to meet the ANSI ratified VITA 66.1 specification for the VPX architecture backplane applications, the Molex VITA 66.1 system simplifies installation and maintenance in demanding military, aerospace and commercial backplane applications. The solution features a patent-pending MT ferrule carrier design that enables accessibility without hand tools and supports up to two MT ferrule ports with up to 48 fiber multi-mode or singlemode connections in standard MT and Molex VersaBeam™ expanded beam MT ferrule technology.
• VersaBeam™ MT Interconnects: These high-density, expanded-beam (lensed) MT ferrule-based interconnects are designed to drastically increase the number of mating cycles compared to standard MT ferrules. The 12 parallel micro-lens interfaces are optimized for 50/125 µm fiber applications and the recessed micro lenses create a non-contacting ferrule interface, which helps eliminate connector failure due to debris generated during mating or handling.
• Polymicro™ Fiber Optic Assemblies: These assemblies incorporate a wide range of design options to meet numerous scientific, industrial and medical optical requirements. The assemblies consist of opto-mechanical and electro-optical components that incorporate standard features with custom-configured fused silica and precision optical components. Added optical features such as micro-machined end tips, metal terminations or precision couplings can be included.

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About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, consumer electronics, industrial, automotive, medical, military and lighting. Established in 1938, the company operates 41 manufacturing locations in 15 countries. The Molex website is www.molex.com. Follow us at www.twitter.com/molexconnectors, watch our videos at www.youtube.com/molexconnectors, connect with us at www.facebook.com/molexconnectors and read our blog at www.connector.com.

Molex is a registered trademark of Molex Incorporated

* InfiniBand is a trademark of the InfiniBand Trade Association

† Vortex Gearbox is a trademark of Avago Technologies